(3) Figures from 4-23 to 4-37 and from 7-14 to 7-21 are fixed to be more accurate.Īdditional Clarification in the Final Version 9 100mA is the maximum current in SPI ( Note 7 of Table 3-5) 9 CMD15 can be issued in data-transfer-mode ( Figure 4-1) 9 If Speed Class is not supported (XPC=0), Class0 is indicated ( Section 4.2.3.1) 9 Only function group 2 in CMD6 has Busy Status ( CMD6) 9 How to set SD_SPEC and SD_SPEC3 ( SCR) 9 CMD_SUPPORT is Bit33-32 of SCR ( SCR) 9 Only CPRM security is maintained in SPI ( Section 7.2.12) (2) Extended Capacity (SDXC) is supported (3) Ultra High Speed I (UHS-I) is supported (4) Speed Class Specification Update (5) Set Block Count Command (CMD23) is added Modification in the Version 3.01 (1) Modifications in the Physical Ver3.00 Supplementary Notes Version 1.00 are applied. (Up to and including 32 GB) Followings are added to the Version 2.00 (1) Physical Ver2.00 Supplementary Notes Version 1.00 is applied. High Capacity SD Memory Card is specified. High-Speed mode is specified.(Up to 25 MB/sec Read/Write rate) - eCommerce command set and Vendor Specific command set are specified - Version 1.10 + Supplementary Notes for Version 1.10. ©Copyright 2001-2010 SD Group (Panasonic, SanDisk, Toshiba) and SD Card Association Physical Layer Specification Version 3.01Ĭhanges compared to previous issue Base version (Draft only) Initial release version - Version 1.01 + Supplementary Notes Version 1.01e(March 21, 2004) - CMD6 (Switch Function command) is specified and CMD34-37, 50 and 57 are reserved for new command system. Panasonic Corporation SanDisk Corporation Toshiba Corporationĭownloaded by Jim Innis Freescale Semiconductor, Inc. Physical Layer Specification Version 3.01
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